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Laser Solder Paste - List of Manufacturers, Suppliers, Companies and Products

Laser Solder Paste Product List

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Laser solder paste "EVASOL 3230 Series"

Laser solder paste "EVASOL 3230 Series"

Supports rapid heating by laser! Specialized in the implementation of micro components.

The "EVASOL 3230 series" is a laser solder paste specially designed to accommodate the mounting of micro components. It uses a special activator that enables rapid heating implementation through light. This reduces slumping during heating and resolves issues with solder balls. Additionally, it prevents the reaction between the flux and powder. Even with minimal dispensing, it achieves high coating stability. 【Features】 ■ Designed specifically for micro components ■ Prevents solder balls ■ Stable dispensing *For more details, please refer to the PDF document or feel free to contact us.

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レーザー用ソルダペースト『EVASOL 3229シリーズ』

レーザー用ソルダペースト『EVASOL 3229シリーズ』

レーザーによる急加熱に対応 ソルダボールの問題を解決

ソルダボールを防止 　　『EVASOL 3229シリーズ』は、レーザーによる急加熱実装を可能にする 　　特殊な活性剤を使用。加熱時のダレを低減し、はんだボールの 　　問題を解決します。 大型部品にも対応 　　チップからコネクタまで大小様々な部品に対応します。 　　複雑化する基板の実装を可能にします。 車載での採用実績 　　Sn-Pbの頃から車載電装品の実装にご採用頂いております。 　　より厳しい実装品質と信頼性を要求されるユーザー様に最適です。 【特長】 ■ソルダボールを防止 ■大型部品にも対応 ■急加熱時のダレを低減 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

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レーザー用ソルダペースト『EVASOL 3230シリーズ』

レーザー用ソルダペースト『EVASOL 3230シリーズ』

レーザーによる急加熱に対応 微小部品の実装に特化

微小部品に特化 　　微小部品の実装に対応するため、専用の設計を行いました。 　　微小部品特有の課題を解決します。 ソルダボールを防止 　　レーザーによる急加熱実装を可能にする特殊な活性剤を使用。 　　加熱時のダレを低減し、はんだボールの問題を解決します。 安定吐出 　　フラックスと粉末の反応を防止しています。 　　微小な吐出でも、高い塗布を実現しています。 【特長】 ■ソルダボールを防止 ■安定吐出 ■微小部品専用設計 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

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Laser solder paste "EVASOL 3232 Series"

Laser solder paste "EVASOL 3232 Series"

Supports rapid heating by laser, specialized for the implementation of micro components.

Halogen-free standard compliant Does not contain Cl and Br, which are the causes of dioxin generation. Complies with most halogen-free standards. Prevention of solder balls Uses a special activator that enables rapid heating implementation by laser. Reduces slumping during heating and resolves solder ball issues. Specialized for micro components Designed specifically to accommodate the implementation of micro components. Addresses challenges unique to micro components. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of narrow pitch terminals ■ Complies with halogen-free standards *For more details, please refer to the PDF materials or feel free to contact us.

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